FR4

Home > Products > FR4

COFAN FR4 AND PRITNED CIRCUIT BOARD FABRICATION SERVICE

Overview

FR-4 is the primary insulating backbone upon which the vast majority of rigid printed circuit boards (PCBs) are produced. A thin layer of copper foil is laminated to one, or both sides of an FR-4 glass epoxy panel. These are commonly referred to as "copper clad laminates."

FR-4 copper-clad sheets are fabricated with circuitry etched into copper layers to produce printed circuit boards. More sophisticated and complex FR-4 printed circuit boards are produced in multiple layers, aka "multilayer circuitry".

For more information

Density	Standard	Advanced & Development
Minimum Line/Spacing - Internal 1/2 oz	.004	.003 1/3 oz
Minimum Line/Spacing - External 1/2 oz	.004	.003 1/3 oz
Minimum Drilled Hole Size	.008	.006
Minimum Solder mask Web	.005	.004
Aspect Ratio - Line Card	12:01	14:01
Land Size (Diameter over Drill)	.010	.008
Thickness (Minimum / Maximum)	7 / 300	5 / 440
Thickness Tolerance	+/- 8	+/- 6
Layer to Layer Registration	+/- .005	+/- .003
Minimum Core Thickness	.004	.003
Minimum Prepreg Fill	.0025	.002
BGA	.5 mm	.4mm
QFP	.5 mm	.4mm

Process	Item	Normal SPEC	Special SPEC
Meterial	150℃ to 180℃	-	-
-	Layer count	16L	20L
Mask	Color	Green / blue / Red / Black / White / Golden / Clear
Silkscreen	Color	White / Black / Red / Yellow
Testing	1. Open / Short Testing Spacing	Dedicate: 6ml Fly probe Spacing: 4mil (Smd Pitch: 10 mil)	-
	2. Open / Short Board Size	edicate: 600x400mm(max) Fly probe: 640x450mm(max)	-
	3. Open / Short Testing Condition	Dedicate: 250V / 50Ω / 2MΩ Fly probe: 250V / 50Ω / 10MΩ min / max: 1MΩ ~ 20MΩ	-
	4. Netlist Test	1). Measure Machine: POLAR 2). Tolerance: ±10% 3). design: Single End / Differential ±10% 4). Testing Pitch: 0.254mm	Tolerance: ±5%
Finish Type	HASL Carbon Ink Imm gold Hard gold Imm Tin Leadfree HAL Imm Silver	Imm Gold+HASL Imm Gold+ENTEK. Carbon+ENTEK Imm gold+G / F(3~30μ) Partial Hard Gold Partial Imm Gold	Imm Gold + SMOBC

HDI & VIAS	Standard	Advanced & Development
BBV Mechanical Drill	.010	.008
Minimum Laser Via (Drill / Capture Pad)	.006/.016	.005/.014
Variable Depth Laser Via (Depth / Diameter)	.004/.006	.004/.005
Microvia Aspect Ratio	.5:1	n/a

Impedance / Controlled	Standard	Advanced & Development
28 - 260Ohms	+/-10%	+/-7%
50 - 150 Ohms	+/-10%	+/-7%

Copper Weights	Standard	Advanced & Development
Min Outer Base Copper - plated layers	1/2 oz	1/4 oz
Max Outer Base Copper - plated layers	5 oz	5 oz
Min Inner Copper Foil - non plated layers	1/4 oz	1/4 oz
Max Inner Copper Foil - non plated layers	4 oz	5 oz

- Material of FR4

Detail

For more information