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Dec 28, 2015

Cofan USA Introduces Copper Thermal Vias Embedded Aluminum Core PCBs for Thermal Dissipation Enhancement

This innovation enables circuit engineers to have much less thermal restriction in circuit design and it offers more flexibility in components selection

April 21 - 25, 2013

Light Fair 2013 in Philadelphia, USA

The world's largest Annual Architectural and commercial lighting trade show was held in Philadelphia from April 21 to April 25, 2013 and COFAN attended as a visitor to read upcoming market trend.

April 11, 2013

EPTECH TRADE SHOW

EPTECH show in Markham, ON, Canada - It covers a very broad spectrum within in the electronics industry and Cofan will exhibit at the show.

April, 2013

COFAN Received Their ITAR Certification

COFAN has received their ITAR Certification and prospects to widen their business market.

February 12-14, 2013

The Strategies in Light Show 2013 in Santa Clara, USA

The leading events for the Global LED and Lighting Industry was held February 12-14 2013 in Santa Clara and COFAN exhibited and introduced our main product, Bendable Metal Core PCBs to visitors.

December, 2012

COFAN received UL.

COFAN has received their UL Certification for Dupont(CooLam 3D) and AISMALIBAR(Flextherm).

May 9-11, 2012

Light Fair

The biggest light show in North America; have some potential and good contacts.

Apr 16-20,2012 Frankfurt

Light & Building

It’s in 10 different Hall with a hall just for Asia exhibitors – China and Taiwan, majority are LED lighting.

Feb 7-9, 2012 Santa Clara CA

Strategies in Light

We exhibited at the show; response was better than last year.more