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Denka

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Material Type Note
1 Base metal plate Aluminum (1050) 1.0, 1.5, 2.0mm
Aluminum (5052) 3.0mm
2 Thermally conductive
dielectric layre		 Epoxy resin filled with
inorganic filler		 Z type Dielectric strength
(AC2kV)
Y type Dielectric strength
(AC3kV)
X type Dielectric strength
(AC5kV)
3 1. Cucicuit Copper foil (Ni plating/
Ni-Au plating available)		 35 §­ For general circuits
70 §­ For general circuits
105 §­ For general circuits
2. Cu circuit with Al pad Al / Cu claded foil Al 40 §­ / Cu 10 §­ For wire-bonding
(bare chip mounting)
Al 40 §­ / Cu 85 §­ For large current circuits
4 Epoxy resin, etc. 5~30 §­
High heat resistant, Ultra high
thermal conductivity type TH-1		 General purpose
type K - 1
Thermal conductivity ( W/m K ) 4.0 2.0
Volume resistivity ( §Ù cm ) at 23¡ÆC 4.1 x 1015 2.2 x 1015
Coefficient of thermal expansion( ¡ÆC1 ) 6.7 x 105 7.8 x 105
Young¡¯s modulus( N/m2 ) 5.4 x 109 5.1 x 109
Poisson¡¯s ratio 0.34 0.30
Glass transition point( ¡ÆC ) 165 104
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